Chipboard Edge Sealing
This new edge sealing system applies fillers on the porous edges of chipboard pieces for obtaining the same density as on the surface. This expands the possibilities of wrapping and allows to get perfect finish even with thin materials.
The system is designed to be integrated into new or existing wrapping lines. The process begins with a thorough surface and edge cleaning for the subsequent application of hot melt fillers on each edge, followed by pressing and smoothing. This way, the edge is homogeneous with the surface of the board and is ready to be covered with low-density materials.
The process is completed with a smoothening phase after the wrapping that highlights the finish quality.